Part Number Manufacturer / Brand Brife Description Part StatusApplicationsCurrent - SupplyVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
NXP USA Inc. IC Regulators MULTIPLE VOLTAGE 20HSOP ActiveIgnition Buffer, Regulator110µA9.5 V ~ 18 V-40°C ~ 85°CSurface Mount20-SOIC (0.433", 11.00mm Width) Exposed Pad20-HSOP
NXP USA Inc. IC SBC HIGH SPD CAN 3.3V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. IC RECEIVER 16KB FLASH 32QFN ActiveWireless Power Receiver120mA3.5 V ~ 20 V-40°C ~ 85°CSurface Mount36-UFBGA, WLCSP36-WLCSP (3.07x2.98)
NXP USA Inc. IC SBC HIGH SPD CAN 3.3V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. SYSTEM BASIS CHIP DCDC 1.5A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. TRANSFORMER PHYSICAL LAYER ActiveIsolated Communications Interface40mA4.5 V ~ 7 V-40°C ~ 125°C (TA)Surface Mount16-SOIC (0.154", 3.90mm Width)16-SOIC
NXP USA Inc. DSC 64 LQFP 64K FLASH Active
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NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 2.2A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. IC ENGINE CTRL SW/DVR 54-SOIC ActiveAutomotive10mA5 V ~ 36 V-40°C ~ 125°CSurface Mount54-SSOP (0.295", 7.50mm Width) Exposed Pad54-SOICW-EP
NXP USA Inc. IC POWER MGMT IMX50/53 130MAPBGA ActiveProcessor370µA3 V ~ 4.5 V-40°C ~ 85°CSurface Mount130-LFBGA130-MAPBGA (8x8)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP CAN 5V 0.7 ActiveSystem Basis Chip13mA2.7 V ~ 36 V-40°C ~ 125°CSurface Mount48-LQFP Exposed Pad48-LQFP-EP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 1.5A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. FS4500 ActiveSystem Basis Chip
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-40°C ~ 150°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP CAN 5V 1.5 ActiveSystem Basis Chip13mA2.7 V ~ 36 V-40°C ~ 125°CSurface Mount48-LQFP Exposed Pad48-LQFP-EP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 1.5A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 2.2A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. FS6500 ActiveSystem Basis Chip
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-40°C ~ 150°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. IC POWER MGMT I.MX35/51 139BGA ActiveBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
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-40°C ~ 85°CSurface Mount139-TFBGA139-PBGA (7x7)
NXP USA Inc. IC POWER MGMT I.MX35/51 139BGA ActiveBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
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-40°C ~ 85°CSurface Mount139-TFBGA139-PBGA (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 1.5A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. IC POWER MGMT I.MX35/51 186BGA ActiveBattery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
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-40°C ~ 85°CSurface Mount186-LFBGA186-PBGA (12x12)
NXP USA Inc. IC CTRL SMALL ENG 2CYL 48LQFP ActiveSmall Engine10mA4.5 V ~ 36 V-40°C ~ 125°CSurface Mount48-LQFP Exposed Pad48-LQFP-EP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 2.2A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP LINEAR 0.5A V ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 1.5A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. FS6500 ActiveSystem Basis Chip
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-40°C ~ 150°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 0.8A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. SYSTEM BASIS CHIP DCDC 2.2A VCO ActiveSystem Basis Chip
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-40°C ~ 125°C (TA)Surface Mount48-LQFP Exposed Pad48-LQFP (7x7)
NXP USA Inc. REGULATOR BUCK QUAD WITH UP TO Active
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NXP USA Inc. REGULATOR BUCK QUAD WITH UP TO Active
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