|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
IC POWER MGMT I.MX35/51 139BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
|
NXP USA Inc. |
IC POWER MGMT I.MX35/51 139BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
|
NXP USA Inc. |
FS6500 |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
IC POWER MGMT I.MX35/51 186BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
|
NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
15W MULTI-COIL AUTO STANDARD |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
SBC DCDC 1.5A VCORE FS1B CAN15 |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
15W MULTI-COIL AUTO PREMIUM L |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
LOW SIDE DRIVER X2 WHEEL SPEED |
Active | Motorcycle Braking | - | 6 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
LOW SIDE DRIVER X4 WHEEL SPEED |
Active | Motorcycle Braking | - | 6 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP CAN 48LQFP |
Active | System Basis Chip | 13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP CAN 48LQFP |
Active | System Basis Chip | 13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
NXP USA Inc. |
IC POWER MANAGEMENT 206MAPBGA |
Not For New Designs | General Purpose | - | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (13x13) |
|
NXP USA Inc. |
PROGRAMMABLE SOLENOID CONTROLLER |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
IC POWER MANAGEMENT 48QFN |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC POWER MGMT IMX50/53 130MAPBGA |
Active | Processor | 370µA | 3 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 130-LFBGA | 130-MAPBGA (8x8) |
|
NXP USA Inc. |
IC POWER MGMT I.MX35/51 186BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
|
NXP USA Inc. |
IC POWER MGMT I.MX7 6LDO QFN 48 |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |