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NXP USA Inc. |
IC Regulators MULTIPLE VOLTAGE 20HSOP |
Active | Ignition Buffer, Regulator | 110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |
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NXP USA Inc. |
IC SBC HIGH SPD CAN 3.3V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
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NXP USA Inc. |
IC SBC HIGH SPEED CAN 5V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
IC RECEIVER 16KB FLASH 32QFN |
Active | Wireless Power Receiver | 120mA | 3.5 V ~ 20 V | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (3.07x2.98) |
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NXP USA Inc. |
IC SBC HIGH SPD CAN 3.3V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
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NXP USA Inc. |
IC SBC HIGH SPEED CAN 5V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
TRANSFORMER PHYSICAL LAYER |
Active | Isolated Communications Interface | 40mA | 4.5 V ~ 7 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
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NXP USA Inc. |
DSC 64 LQFP 64K FLASH |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
IC ENGINE CTRL SW/DVR 54-SOIC |
Active | Automotive | 10mA | 5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOICW-EP |
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NXP USA Inc. |
IC POWER MGMT IMX50/53 130MAPBGA |
Active | Processor | 370µA | 3 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 130-LFBGA | 130-MAPBGA (8x8) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP CAN 5V 0.7 |
Active | System Basis Chip | 13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
FS4500 |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP CAN 5V 1.5 |
Active | System Basis Chip | 13mA | 2.7 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
FS6500 |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
IC POWER MGMT I.MX35/51 139BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
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NXP USA Inc. |
IC POWER MGMT I.MX35/51 139BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
IC POWER MGMT I.MX35/51 186BGA |
Active | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
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NXP USA Inc. |
IC CTRL SMALL ENG 2CYL 48LQFP |
Active | Small Engine | 10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 1.5A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
FS6500 |
Active | System Basis Chip | - | - | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 0.8A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP DCDC 2.2A VCO |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
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NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
REGULATOR BUCK QUAD WITH UP TO |
Active | - | - | - | - | - | - | - |