Numero di parte Produttore / Marca Breve descrizione Stato parteapplicazioniCorrente - FornituraTensione - Fornituratemperatura di esercizioTipo di montaggioPacchetto / casoPacchetto dispositivo fornitore
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- Activei.MX Processors
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. 5W MULTI-COIL AUTO 5V PREMIUM ActiveWireless Power Transmitter
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2.7 V ~ 3.6 V-40°C ~ 105°CSurface Mount64-LQFP64-LQFP (10x10)
NXP USA Inc. IC USB POWER MANAGER 20-QFN ActiveOR Controller, UART/USB Data, Audio Management9µA2.7 V ~ 5.5 V-40°C ~ 85°CSurface Mount20-UFQFN Exposed Pad20-QFN-EP (3x4)
NXP USA Inc. IC USB POWER MANAGER 20-QFN ActiveOR Controller, UART/USB Data, Audio Management9µA2.7 V ~ 5.5 V-40°C ~ 85°CSurface Mount20-UFQFN Exposed Pad20-QFN-EP (3x3)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-PQFN (6x6)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-PQFN (6x6)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-PQFN (6x6)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-PQFN (6x6)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-PQFN (6x6)
NXP USA Inc. IC POWER MGMT I.MX7 6LDO QFN 48 ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 18 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 18 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 105°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 105°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 105°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 105°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1510 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 105°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. IC SWITCH HIGH SIDE Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-SSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC EP
NXP USA Inc. IC SBC HIGH SPEED CAN 5V 32SOIC Last Time BuySystem Basis Chip2mA5.5 V ~ 28 V-40°C ~ 125°CSurface Mount32-BSSOP (0.295", 7.50mm Width) Exposed Pad32-SOIC
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. IC SYSTEM BASIS CHIP LIN 32-LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
-
2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
-
2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
-
2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
-
2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC I.MX7 PRE- ActiveProcessor
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2.8 V ~ 5.5 V-40°C ~ 85°CSurface Mount48-VFQFN Exposed Pad48-QFN (7x7)
NXP USA Inc. POWER MANAGEMENT IC 3 BUCK REGS ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. PF1550 ActiveEmbedded systems, Low-Power IoT, Mobile/Wearable Devices
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3.8 V ~ 7 V-40°C ~ 85°CSurface Mount40-VFQFN Exposed Pad40-QFN (5x5)
NXP USA Inc. IC SYSTEM BASIS CHIP 32LQFP ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
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