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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
5W MULTI-COIL AUTO 5V PREMIUM |
Active | Wireless Power Transmitter | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
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NXP USA Inc. |
IC USB POWER MANAGER 20-QFN |
Active | OR Controller, UART/USB Data, Audio Management | 9µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN-EP (3x4) |
|
NXP USA Inc. |
IC USB POWER MANAGER 20-QFN |
Active | OR Controller, UART/USB Data, Audio Management | 9µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN-EP (3x3) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-PQFN (6x6) |
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NXP USA Inc. |
IC POWER MGMT I.MX7 6LDO QFN 48 |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1510 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC SWITCH HIGH SIDE |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
|
NXP USA Inc. |
IC SBC HIGH SPEED CAN 5V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP LIN 32-LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |