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NXP USA Inc. |
IC TRANSCEIVER |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
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NXP USA Inc. |
DSC 64 LQFP 64K FLASH |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
IC SYSTEM BASIS CHIP 32LQFP |
Active | System Basis Chip | 4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
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NXP USA Inc. |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE |
Active | - | - | - | - | - | - | - |
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NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
IC CTRL SMALL ENG 1CYL 48LQFP |
Active | Small Engine | 10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
IC TRANSCEIVER |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
IC TRANSCEIVER |
Active | - | - | - | - | - | - | - |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | i.MX Processors | - | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE- |
Active | Processor | - | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
IC SWITCH HIGH SIDE 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
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NXP USA Inc. |
IC SBC HIGH SPEED CAN 5V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
|
NXP USA Inc. |
IC SWITCH HIGH SIDE |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
|
NXP USA Inc. |
IC SBC HIGH SPEED CAN 5V 32SOIC |
Last Time Buy | System Basis Chip | 2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
POWER MANAGEMENT IC 3 BUCK REGS |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
PF1550 |
Active | Embedded systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
|
NXP USA Inc. |
IC Regulators MULTIPLE VOLTAGE 20HSOP |
Active | Ignition Buffer, Regulator | 110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |
|
NXP USA Inc. |
IC DVR 8-CH ENGINE CTRL 32-SOIC |
Active | Automotive | 10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
|
NXP USA Inc. |
IC CTRL SMALL ENG 2CYL 48LQFP |
Active | Small Engine | 10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
NXP USA Inc. |
SYSTEM BASIS CHIP LINEAR 0.5A V |
Active | System Basis Chip | - | - | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |