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Harwin Inc. |
RFI SHIELD CLIP MINI TIN SMD |
Active | Shield Clip | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.039" (1.00mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -40°C ~ 85°C |
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TE Connectivity AMP Connectors |
SHIELD FINGER LOOSE PIECE TYPE |
Active | Shield Finger, Pre-Loaded | - | 0.094" (2.40mm) | 0.154" (3.90mm) | 0.039" (1.00mm) | Copper Alloy | Gold | 19.685µin (0.50µm) | Solder | - |
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ITT Cannon, LLC |
MICRO UNIVERSAL CONTACT Z 1.8MM |
Active | Shield Finger, Pre-Loaded | - | 0.038" (0.96mm) | 0.098" (2.50mm) | 0.071" (1.80mm) | Titanium Copper | Nickel | 118.11µin (3.00µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD CLIP MICRO TIN SMD |
Active | Shield Clip | - | 0.035" (0.90mm) | 0.256" (6.50mm) | 0.054" (1.37mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -25°C ~ 150°C |
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ITT Cannon, LLC |
MICRO UNIVERSAL CONTACT Z 2.5MM |
Active | Shield Finger, Pre-Loaded | - | 0.038" (0.96mm) | 0.144" (3.66mm) | 0.098" (2.50mm) | Titanium Copper | Nickel | 118.11µin (3.00µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD FINGER AU 1.7MM SMD |
Active | Shield Finger | - | 0.059" (1.50mm) | 0.106" (2.70mm) | 0.067" (1.70mm) | Copper Alloy | Gold | Flash | Solder | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
PRE-LOADED SPRING FINGER 1.8MM |
Active | Shield Finger, Pre-Loaded | - | 0.045" (1.15mm) | 0.128" (3.26mm) | 0.071" (1.80mm) | Stainless Steel | Gold | 19.69µin (0.50µm) | Solder | - |
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ITT Cannon, LLC |
UNIVERSAL CONTACT 1.8MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.035" (0.90mm) | 0.132" (3.35mm) | 0.071" (1.80mm) | Beryllium Copper | Nickel | 118.11µin (3.00µm) | Solder | - |
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ITT Cannon, LLC |
UNIVERSAL CONTACT 2.5MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.043" (1.10mm) | 0.192" (4.87mm) | 0.098" (2.50mm) | Beryllium Copper | Gold | 5.906µin (0.15µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD CLIP MICRO TIN SMD |
Active | Shield Clip | - | 0.024" (0.60mm) | 0.177" (4.50mm) | 0.035" (0.90mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -25°C ~ 150°C |
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TE Connectivity AMP Connectors |
PRE-LOADED SPRING FINGER 3MM |
Active | Shield Finger, Pre-Loaded | - | 0.045" (1.15mm) | 0.128" (3.26mm) | 0.118" (3.00mm) | Stainless Steel | Gold | 11.81µin (0.30µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD CLIP MINI TIN SMD |
Active | Shield Clip | - | 0.043" (1.10mm) | 0.233" (5.92mm) | 0.083" (2.10mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -40°C ~ 85°C |
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Harwin Inc. |
RFI SHIELD CLIP MINI TIN SMD |
Active | Shield Clip | - | 0.042" (1.07mm) | 0.207" (5.25mm) | 0.088" (2.23mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -40°C ~ 125°C |
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TE Connectivity AMP Connectors |
SHIELDFINGER1312ATYPE |
Active | Shield Finger | - | 0.047" (1.20mm) | 0.177" (4.50mm) | 0.051" (1.30mm) | Copper Alloy | Gold | 2µin (0.05µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD CLIP R/A TIN SMD |
Active | Shield Clip | - | 0.031" (0.80mm) | 0.185" (4.70mm) | 0.055" (1.40mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -25°C ~ 150°C |
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ITT Cannon, LLC |
UNIVERSAL CONTACT 3.5MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.043" (1.10mm) | 0.197" (5.00mm) | 0.138" (3.50mm) | Beryllium Copper | Nickel | 118.11µin (3.00µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD CLIP MAXI TIN SMD |
Active | Shield Clip | - | 0.090" (2.28mm) | 0.346" (8.79mm) | 0.144" (3.65mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -25°C ~ 150°C |
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Harwin Inc. |
RFI SHIELD CLIP TIN SMD |
Active | Shield Clip | - | 0.090" (2.28mm) | 0.346" (8.79mm) | 0.140" (3.55mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -40°C ~ 125°C |
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ITT Cannon, LLC |
UNIVERSAL CONTACT 4MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.043" (1.10mm) | 0.194" (4.92mm) | 0.157" (4.00mm) | Beryllium Copper | Nickel | 118.11µin (3.00µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD FINGER AU 4MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.098" (2.50mm) | 0.157" (4.00mm) | 0.157" (4.00mm) | Copper Alloy | Gold | Flash | Solder | -55°C ~ 125°C |
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Harwin Inc. |
RFI SHIELD FINGER AU 5MM SMD |
Active | Shield Finger | - | 0.118" (3.00mm) | 0.177" (4.50mm) | 0.197" (5.00mm) | Phosphor Bronze | Gold | Flash | Solder | -20°C ~ 70°C |
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TE Connectivity AMP Connectors |
SHIELDFINGER0820TYPE |
Active | Shield Finger | - | 0.079" (2.00mm) | 0.134" (3.40mm) | 0.031" (0.80mm) | Copper Alloy | Gold | Flash | Solder | - |
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TE Connectivity AMP Connectors |
3100069SEALEDFINGR1715EMBOS |
Active | Shield Finger | - | 0.059" (1.50mm) | 0.106" (2.70mm) | 0.067" (1.70mm) | Copper Alloy | Gold | 3.937µin (0.10µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD FINGER AU 5.5MM SMD |
Active | Shield Finger | - | 0.114" (2.90mm) | 0.274" (6.95mm) | 0.219" (5.57mm) | Copper Alloy | Gold | Flash | Solder | -55°C ~ 125°C |
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Harwin Inc. |
RFI SHIELD FINGER AU 6MM SMD |
Active | Shield Finger, Pre-Loaded | - | 0.098" (2.50mm) | 0.157" (4.00mm) | 0.236" (6.00mm) | Copper Alloy | Gold | Flash | Solder | -55°C ~ 125°C |
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TE Connectivity AMP Connectors |
SHIELD FINGER 3014 ANTI OVER STR |
Active | Shield Finger, Pre-Loaded | - | 0.055" (1.40mm) | 0.173" (4.40mm) | 0.118" (3.00mm) | Copper Alloy | Gold | 19.685µin (0.50µm) | Solder | - |
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Laird Technologies EMI |
CONTACT BECU 2.9X1.5MM |
Active | - | - | - | - | - | - | - | - | - | - |
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TE Connectivity AMP Connectors |
SHIELD FINGER 3025-Z1-T |
Active | Shield Finger | - | 0.098" (2.50mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Titanium Copper | Gold | 2µin (0.05µm) | Solder | - |
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Harwin Inc. |
RFI SHIELD FINGER TIN SMD |
Active | Shield Finger | - | 0.224" (5.70mm) | 0.378" (9.59mm) | 0.285" (7.25mm) | Beryllium Copper | Tin | 118.11µin (3.00µm) | Solder | - |
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Laird Technologies EMI |
CONTACT BECU 6.0X4.3MM |
Active | Shield Finger | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | - | - | - |
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Laird Technologies EMI |
CARD GUI CLIPON BECU 2.03X9.53MM |
Active | Fingerstock | - | 0.084" (2.13mm) | 0.375" (9.53mm) | 0.062" (1.57mm) | Beryllium Copper | - | - | Clip | 121°C |
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Laird Technologies EMI |
GSKT FAB/FOAM 6.4X457.2MM DSHAPE |
Active | Fabric Over Foam | D-Shape | 0.252" (6.40mm) | 18.000" (457.20mm) | 0.059" (1.50mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
GSKT FAB/FOAM 6.4X457.2MM DSHAPE |
Active | Fabric Over Foam | D-Shape | 0.252" (6.40mm) | 18.000" (457.20mm) | 0.142" (3.60mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
OSTRSD ECE089 |
Active | Fabric Over Foam | Round | 0.070" (1.70mm) | 12.000" (304.80mm) | - | Polyurethane Foam, Nylon | - | - | - | - |
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Laird Technologies EMI |
GASKET FAB/FOAM 12.7X457.2MM REC |
Active | Fabric Over Foam | Rectangle | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
GSKT FAB/FOAM 12.7X457.2MM DSHP |
Active | Fabric Over Foam | D-Shape | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.374" (9.50mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
GASKT FAB/FOAM 12.7X457.2MM BELL |
Active | Fabric Over Foam | Bell | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.142" (3.60mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
GASKET BECU 15.88X11.35MM |
Active | - | - | 0.625" (15.88mm) | 0.447" (11.35mm) | - | - | - | - | - | - |
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Laird Technologies EMI |
GASKET FAB/FOAM 12.7X457.2MM SQ |
Active | Fabric Over Foam | Square | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.500" (12.70mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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Laird Technologies EMI |
GASKET FABRIC/FOAM 15X457.2MM SQ |
Active | - | Square | 0.591" (15.00mm) | 18.000" (457.20mm) | - | - | - | - | - | - |
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Laird Technologies EMI |
GASKET FAB/FOAM 8X457.2MM CFOLD |
Active | Fabric Over Foam | C-Fold | 0.315" (8.00mm) | 18.000" (457.20mm) | 0.315" (8.00mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | Adhesive | - |
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Wurth Electronics Inc. |
GASKET FABRIC/FOAM 2MMX1M DSHAPE |
Active | Fabric Over Foam | D-Shape | 0.079" (2.00mm) | 39.370" (1.00m) | 0.059" (1.50mm) | Polyurethane Foam, Rayon Paper | - | - | Non-Conductive Adhesive | -40°C ~ 85°C |
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Laird Technologies EMI |
GASKET BECU 15.24X609.60MM |
Active | Fingerstock | - | 0.600" (15.24mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
GASKET BECU ALLOY 6.35X406.4MM |
Active | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.080" (2.03mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
ECCOSORB AN-73 24X24 |
Active | Absorbing Sheet | Sheet | 24.016" (610.00mm) | 24.016" (610.00mm) | - | Polyurethane Foam | - | - | - | - |
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Laird Technologies EMI |
ECCOSORB 24X24 |
Active | Absorbing Sheet | Sheet | 24.016" (610.00mm) | 24.016" (610.00mm) | - | Polyurethane Foam | - | - | - | - |
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Laird Technologies EMI |
ECCOSORB 24X24 |
Active | Absorbing Sheet | Sheet | 24.016" (610.00mm) | 24.016" (610.00mm) | - | Polyurethane Foam | - | - | - | - |
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Laird Technologies EMI |
ECCOSORB 24X24 |
Active | Absorbing Sheet | Sheet | 24.016" (610.00mm) | 24.016" (610.00mm) | - | Polyurethane Foam | - | - | - | - |
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Molex, LLC |
SPRING CONTACT 0.70MM - 1.10MM H |
Active | Shield Finger, Pre-Loaded | - | 0.087" (2.20mm) | 0.154" (3.90mm) | 0.055" (1.40mm) | Stainless Steel | Gold | 19.685µin (0.50µm) | Solder | - |
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Molex, LLC |
ANTI SNAG SPRING CONT 0.25UM GLD |
Active | Shield Finger, Pre-Loaded | - | 0.039" (1.00mm) | 0.138" (3.50mm) | 0.043" (1.10mm) | Stainless Steel | Gold | 39.370µin (1.00µm) | Solder | - |
