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Leader Tech Inc. |
0.22 X 0.62 BD 15--22-S-62DTS-BD |
Active | Fingerstock | - | 0.600" (15.24mm) | 15.000" (381.00mm) | 0.220" (5.59mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.03 X 0.15 X 070 SN 16--TWIST C |
Active | Fingerstock | - | 0.230" (5.84mm) | 16.000" (406.40mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.11 X 0.28 X 0.23 BD 16--FOLDED |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.03 X 0.08 SN 24--TWIST RIGHT A |
Active | Fingerstock | - | 0.080" (2.03mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.03 X 0.15 X 070 BD 16--TWIST C |
Active | Fingerstock | - | 0.230" (5.84mm) | 16.000" (406.40mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Laird Technologies EMI |
APSTRBFUSFPSA |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Leader Tech Inc. |
0.23 X 0.60 SN 16--FOLDED SERIES |
Active | Fingerstock | - | 0.600" (15.24mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.14 X 0.51 BD 16--FOLDED SERIES |
Active | Fingerstock | - | 0.510" (12.95mm) | 16.000" (406.40mm) | 0.140" (3.56mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.25 X 1.09 NI 24--FOLDED SERIES |
Active | Fingerstock | - | 1.090" (27.69mm) | 24.000" (609.60mm) | 0.250" (6.35mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |
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Laird Technologies EMI |
NOSGSTRZNCPSA |
Active | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.080" (2.03mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
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Parker Chomerics |
CHO-SEAL 1298 AG/AL EMI 0.103 |
Active | Gasket | Round | 0.103" (2.62mm) | - | 0.103" (2.62mm) | Conductive Elastomer | Silver | - | Non-Conductive Adhesive | -29°C ~ 66°C |
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Laird Technologies EMI |
AP COIL SNB PSA |
Active | Fingerstock | - | 0.600" (15.24mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
FINGERSTOCK BECU 3.81X406.4MM |
Active | Fingerstock | - | 0.150" (3.81mm) | 16.000" (406.40mm) | 0.030" (0.76mm) | Beryllium Copper | - | - | Clip | 121°C |
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Laird Technologies EMI |
FINGERSTOCK BECU 11.43X381MM |
Active | Fingerstock | - | 0.450" (11.43mm) | 15.000" (381.00mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
FINGERSTOCK BECU 11.43X381MM |
Active | Fingerstock | - | 0.450" (11.43mm) | 15.000" (381.00mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
NOSGSTRBFUSFTPSA |
Active | Fingerstock | - | 0.510" (12.95mm) | 16.000" (406.40mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
NOSGSTRSNBUSFTPSA |
Active | Fingerstock | - | 0.600" (15.24mm) | 16.200" (411.48mm) | 0.152" (3.86mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Slot | 121°C |
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Laird Technologies EMI |
TWTSTRNIB |
Active | Fingerstock | - | 0.500" (12.70mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | - | - | Adhesive | 121°C |
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Laird Technologies EMI |
CSTRSTRBFUSFT |
Active | - | - | - | - | - | - | - | - | - | - |
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Laird Technologies EMI |
DSTRHOLECE093PSA 12.4X8.2X6.2X |
Active | - | - | - | - | - | - | - | - | - | - |
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Laird Technologies EMI |
NOSGSTRSNBPSA |
Active | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.080" (2.03mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
NOSGSTRNIBPSA |
Active | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.080" (2.03mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
S3STRZNCUSFTPSA |
Active | Fingerstock | - | 0.620" (15.75mm) | 15.000" (381.00mm) | 0.220" (5.59mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRSNSATUSFTPSA |
Active | Fingerstock | - | 0.340" (8.64mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRZNCUSFTPSA |
Active | Fingerstock | - | 0.340" (8.64mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRNIBUSFTPSA |
Active | Fingerstock | - | 0.340" (8.64mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRSNBUSFTPSA |
Active | Fingerstock | - | 0.200" (5.08mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRSNSATUSFTPSA |
Active | Fingerstock | - | 0.300" (7.62mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Tin | 299.21µin (7.60µm) | Adhesive | 121°C |
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Laird Technologies EMI |
TWTSTRZNCUSFTPSA |
Active | Fingerstock | - | 0.300" (7.62mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | 121°C |
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|
Leader Tech Inc. |
0.11 X 0.28 BD 16--FOLDED SERIES |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.11 X 0.28 X 0.24 BD 16.0--FOLD |
Active | Fingerstock | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Leader Tech Inc. |
0.14 X 0.37 BD 16--FOLDED SERIES |
Active | Fingerstock | - | 0.370" (9.40mm) | 16.000" (406.40mm) | 0.140" (3.56mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
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Laird Technologies EMI |
LSSTRBF |
Active | Fingerstock | - | 0.800" (20.32mm) | 18.750" (476.25mm) | 0.300" (7.62mm) | Beryllium Copper | - | - | Hardware | 121°C |
|
|
Leader Tech Inc. |
0.03 X 0.23 NI 24--3-23T-NI-24-- |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Nickel | Flash | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.03 X 0.15 X 040 BD 16--TWIST C |
Active | Fingerstock | - | 0.230" (5.84mm) | 16.000" (406.40mm) | 0.030" (0.76mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
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Leader Tech Inc. |
0.03 X 0.23 SN 24--3-S-23T-SN-24 |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
|
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Leader Tech Inc. |
0.03 X 0.23 SN 24 NTP--3-S-23T-S |
Active | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.030" (0.76mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.28 X 0.49 SN16--28-49U-SN-16-- |
Active | Fingerstock | - | 0.490" (12.44mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Beryllium Copper | Tin | Flash | Adhesive | -55°C ~ 121°C |
|
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Leader Tech Inc. |
0.07 X 0.34 BD 24--6-34T-BD-24-- |
Active | Fingerstock | - | 0.340" (8.64mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.07 X 0.14 BD 24--TWIST RIGHT A |
Active | Fingerstock | - | 0.140" (3.56mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Laird Technologies EMI |
APSTRBFUSFPSA |
Active | Fingerstock | - | 0.370" (9.40mm) | 16.000" (406.40mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
|
Laird Technologies EMI |
GASKET FAB/FOAM 0.195 X 48 |
Active | Fabric Over Foam | Square | 0.197" (5.00mm) | 48.000" (121.92cm) | 0.197" (5.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
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|
Laird Technologies EMI |
AP COIL BF USFT PSA |
Active | Fingerstock | - | 0.600" (15.24mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Beryllium Copper | Unplated | - | Adhesive | 121°C |
|
|
Laird Technologies EMI |
FINGERSTOCK BECU 5.33X406.4MM |
Active | Fingerstock | - | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Clip | 121°C |
|
|
Laird Technologies EMI |
GK NICU NRS PU V0 CSH |
Active | Fabric Over Foam | C-Fold | 0.591" (15.00mm) | 9.500" (241.30mm) | 0.673" (17.10mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | - | - |
|
|
Leader Tech Inc. |
0.13 X 0.37 BD 16--13-S-37AH-BD- |
Active | Fingerstock | - | 0.370" (9.40mm) | 16.000" (406.40mm) | 0.130" (3.30mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.11 X 0.375 BD 16--FOLDED SERIE |
Active | Fingerstock | - | 0.380" (9.65mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.09 X 0.78 BD 16--9-78D-A-BD-16 |
Active | Fingerstock | - | 0.780" (19.81mm) | 16.000" (406.40mm) | 0.090" (2.29mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
0.09 X 0.78 BD 16--9-78D-BD-16-- |
Active | Fingerstock | - | 0.780" (19.81mm) | 16.000" (406.40mm) | 0.090" (2.29mm) | Beryllium Copper | Unplated | - | Adhesive | -55°C ~ 121°C |
|
|
Leader Tech Inc. |
ENCLOSURE CLIP ON |
Active | Fingerstock | - | 0.300" (7.62mm) | 16.000" (406.40mm) | 0.170" (4.32mm) | Beryllium Copper | - | - | Clip | -55°C ~ 121°C |
