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Manufacturers for RFI and EMI - Contacts, Fingerstock and Gaskets

Amphenol Information Communication & Commercial
Harwin
ITT Interconnect Solutions
Laird
Leader Tech Inc.
Molex
Parker Chomerics
Pulse Electronics Corporation
TE Connectivity
Wurth Electronics
Part Number Manufacturer / Brand Brife Description Part StatusTypeShapeWidthLengthHeightMaterialPlatingPlating - ThicknessAttachment MethodOperating Temperature
0077008402
 Laird Technologies EMI GASKET BECU 9.4X406.4MM ActiveFingerstock
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0.370" (9.40mm)16.000" (406.40mm)0.130" (3.30mm)Beryllium Copper
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Adhesive121°C
0077001402
 Laird Technologies EMI GASKET BECU ALLOY 15.24X609.6MM ActiveFingerstock
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0.600" (15.24mm)24.000" (609.60mm)0.220" (5.59mm)Beryllium Copper
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Adhesive121°C
0077007102
 Laird Technologies EMI GASKET BECU 11.43X411.48MM ActiveFingerstock
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0.450" (11.43mm)16.200" (411.48mm)0.122" (3.10mm)Beryllium Copper
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Adhesive121°C
0077004302
 Laird Technologies EMI GASKET BECU ALLOY 11.43X406.4MM ActiveFingerstock
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0.450" (11.43mm)16.000" (406.40mm)0.080" (2.03mm)Beryllium Copper
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Adhesive121°C
0097022102
 Laird Technologies EMI FINGERSTOCK BECU 3.18X304.8MM Active
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0.125" (3.18mm)12.000" (304.80mm)
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0097061102
 Laird Technologies EMI FINGERSTOCK BECU 7.57X406.4MM ActiveFingerstock
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0.300" (7.62mm)16.000" (406.40mm)0.170" (4.32mm)Beryllium Copper
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Clip121°C
25-55CPS-SN-16
 Leader Tech Inc. COPPER BERYLLIUM FINGERSTOCK EMI ActiveFingerstock
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0.550" (13.97mm)16.000" (406.40mm)0.250" (6.35mm)Beryllium CopperTin
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Adhesive
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0097055002
 Laird Technologies EMI FINGERSTOCK BECU ALLOY 6X609.6MM ActiveFingerstock
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0.230" (5.84mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium Copper
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Adhesive121°C
0097055102
 Laird Technologies EMI FINGERSTOCK BECU 4X609.6MM ActiveFingerstock
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0.160" (4.06mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium Copper
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Adhesive121°C
0097097402
 Laird Technologies EMI FINGERSTOCK BECU 4.6X406.4MM Active
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0.181" (4.60mm)16.000" (406.40mm)
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3022010
 Wurth Electronics Inc. GASKET FABRIC/FOAM 20MMX1M RECT ActiveFabric Over FoamRectangle0.787" (20.00mm)39.370" (1.00m)0.394" (10.00mm)Polyurethane Foam, Rayon Paper
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Non-Conductive Adhesive-40°C ~ 85°C
0097065402
 Laird Technologies EMI FINGERSTOCK BECU 1.6X304.8MM Active
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0.063" (1.60mm)12.000" (304.80mm)
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0097043802
 Laird Technologies EMI FINGERSTOCK BECU 27.69MMX406.4MM ActiveFingerstock
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1.090" (27.69mm)16.000" (406.40mm)0.250" (6.35mm)Beryllium Copper
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Hardware, Rivet, Solder121°C
0097055902
 Laird Technologies EMI FINGRSTOCK BECU ALY 7.57X609.6MM ActiveFingerstock
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0.300" (7.62mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium Copper
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Adhesive121°C
0097064002
 Laird Technologies EMI FINGERSTOCK BECU 27.69X406.4MM ActiveFingerstock
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0.210" (5.33mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium Copper
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Clip121°C
0097056002
 Laird Technologies EMI FINGERSTOCK BECU 12.7X609.6MM ActiveFingerstock
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0.500" (12.70mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium Copper
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Adhesive121°C
0097054002
 Laird Technologies EMI GASKET BECU 7.11X406.4MM ActiveFingerstock
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0.280" (7.11mm)16.000" (406.40mm)0.110" (2.79mm)Beryllium Copper
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Adhesive121°C
0097055517
 Laird Technologies EMI FINGERSTOCK BECU 8.64X609.6MM ActiveFingerstock
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0.340" (8.64mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Adhesive121°C
0097052002
 Laird Technologies EMI GASKET BECU 9.4X406.40MM ActiveFingerstock
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0.370" (9.40mm)16.000" (406.40mm)0.140" (3.56mm)Beryllium Copper
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Adhesive121°C
0097065502
 Laird Technologies EMI FINGERSTOCK BECU 1.7X304.8MM Active
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0.067" (1.70mm)12.000" (304.80mm)
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0097065602
 Laird Technologies EMI FINGERSTOCK BECU 6.35X406.4MM Active
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0.250" (6.35mm)16.000" (406.40mm)
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-
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4572AB01K09600
 Laird Technologies EMI GASKET FAB/FOAM 10MMX2.44M RECT ActiveFabric Over FoamRectangle0.394" (10.00mm)96.000" (243.84cm)0.016" (0.40mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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-
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78084099
 Laird Technologies EMI ECCOSORB 24X24 ActiveAbsorbing SheetSheet24.016" (610.00mm)24.016" (610.00mm)
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Polyurethane Foam
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S0961-46R
 Harwin Inc. RFI SHIELD CLIP MINI TIN SMD ActiveShield Clip
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0.039" (1.00mm)0.256" (6.50mm)0.050" (1.28mm)Stainless SteelTin118.11µin (3.00µm)Solder-40°C ~ 85°C
1551574-5
 TE Connectivity AMP Connectors PRE-LOADED SPRING FINGER 2.6MM ActiveShield Finger, Pre-Loaded
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0.045" (1.15mm)0.128" (3.26mm)0.102" (2.60mm)Stainless SteelGold19.69µin (0.50µm)Solder
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3-2199250-2
 TE Connectivity AMP Connectors 2.9H SPRNG FINGER TYPE C SMT ActiveShield Finger, Pre-Loaded
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0.059" (1.50mm)0.136" (3.45mm)0.114" (2.90mm)Copper AlloyGold19.685µin (0.50µm)Solder
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120220-0314
 ITT Cannon, LLC MICRO UNIVERSAL CONTACT Z 3.5MM ActiveShield Finger, Pre-Loaded
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0.038" (0.96mm)0.149" (3.79mm)0.138" (3.50mm)Titanium CopperNickel118.11µin (3.00µm)Solder
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67SLG030030050PI00
 Laird Technologies EMI METAL FILM OVER FOAM CONTACTS ActiveFilm Over FoamRectangle0.118" (3.00mm)0.197" (5.00mm)0.118" (3.00mm)Polyurethane Foam, Tin-Copper Polyester (SN/CU)
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Solder-40°C ~ 70°C
3-2199250-4
 TE Connectivity AMP Connectors 3.6H SPRNG FINGER TYPE C SMT ActiveShield Finger, Pre-Loaded
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0.059" (1.50mm)0.136" (3.45mm)0.142" (3.60mm)Copper AlloyGold19.685µin (0.50µm)Solder
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3-2199250-3
 TE Connectivity AMP Connectors 3.2H SHLD FINGER LOOSE TYP C SMT ActiveShield Finger, Pre-Loaded
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0.059" (1.50mm)0.136" (3.45mm)0.126" (3.20mm)Copper AlloyGold19.685µin (0.50µm)Solder
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2108613-5
 TE Connectivity AMP Connectors 2.4H SPRING FINGER W/EMBOSS ActiveShield Finger, Pre-Loaded
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0.039" (0.98mm)0.039" (1.00mm)0.094" (2.40mm)Copper AlloyGoldFlashSolder
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S7101-42R
 Harwin Inc. RFI SHIELD FINGER AU 3.5MM SMD ActiveShield Finger, Pre-Loaded
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0.098" (2.50mm)0.159" (4.05mm)0.138" (3.50mm)Copper AlloyGoldFlashSolder-55°C ~ 125°C
S1761-46R
 Harwin Inc. EMI SHIELD FINGER TR2000/R ActiveShield Finger
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0.098" (2.50mm)0.177" (4.50mm)0.138" (3.50mm)Stainless SteelTin98.43µin (2.50µm)Solder-55°C ~ 125°C
1447009-7
 TE Connectivity AMP Connectors SHIELD FINGER 3525 ActiveShield Finger
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0.098" (2.50mm)0.177" (4.50mm)0.138" (3.50mm)
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Solder
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67SLG060080070PI00
 Laird Technologies EMI METAL FILM OVER FOAM CONTACTS ActiveFilm Over FoamRectangle0.236" (6.00mm)0.276" (7.00mm)0.315" (8.00mm)Polyurethane Foam, Tin-Copper Polyester (SN/CU)
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Solder-40°C ~ 70°C
67SLH060080070PI00
 Laird Technologies EMI METAL FILM OVER FOAM CONTACTS ActiveFilm Over FoamHourglass0.236" (6.00mm)0.276" (7.00mm)0.315" (8.00mm)Polyurethane Foam, Tin-Copper Polyester (SN/CU)
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Solder-40°C ~ 70°C
67SLH060100050PI00
 Laird Technologies EMI METAL FILM OVER FOAM CONTACTS ActiveFilm Over FoamHourglass0.236" (6.00mm)0.197" (5.00mm)0.394" (10.00mm)Polyurethane Foam, Tin-Copper Polyester (SN/CU)
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Solder-40°C ~ 70°C
BMI-C-001
 Laird Technologies EMI CONTACT BECU 3.1X2.5MM Active
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67SLG100100100PI00
 Laird Technologies EMI METAL FILM OVER FOAM CONTACTS ActiveFilm Over FoamRectangle0.394" (10.00mm)0.394" (10.00mm)0.394" (10.00mm)Polyurethane Foam, Tin-Copper Polyester (SN/CU)
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Solder-40°C ~ 70°C
331031271520
 Wurth Electronics Inc. CONTACT FINGER EMI SMD ActiveShield Finger
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0.059" (1.50mm)0.106" (2.70mm)0.079" (2.00mm)Beryllium CopperGoldFlashSolder-40°C ~ 100°C
331171302030
 Wurth Electronics Inc. CONTACT FINGER EMI SMD ActiveShield Finger
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0.079" (2.00mm)0.118" (3.00mm)0.118" (3.00mm)Beryllium CopperGoldFlashSolder-40°C ~ 100°C
331051472057
 Wurth Electronics Inc. CONTACT FINGER EMI SMD ActiveShield Finger
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0.079" (2.00mm)0.185" (4.70mm)0.224" (5.70mm)Beryllium CopperGoldFlashSolder-40°C ~ 100°C
0077001502
 Laird Technologies EMI GASKET BECU 15.24X6.35MM ActiveFingerstock
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0.600" (15.24mm)0.250" (6.35mm)0.220" (5.59mm)Beryllium Copper
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Adhesive121°C
0077001802
 Laird Technologies EMI GASKET BECU 8.1X13.82MM ActiveFingerstock
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0.320" (8.13mm)0.543" (13.79mm)0.110" (2.79mm)Beryllium Copper
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Slot121°C
0077009402
 Laird Technologies EMI GASKET BECU 9.1X9.88MM ActiveFingerstock
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0.358" (9.09mm)0.389" (9.88mm)0.128" (3.25mm)Beryllium Copper
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Slot121°C
4283PA51H01800
 Laird Technologies EMI GASKET FAB/FOAM 4X457.2MM DSHAPE ActiveFabric Over FoamD-Shape0.157" (4.00mm)18.000" (457.20mm)0.079" (2.00mm)Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
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Adhesive
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4569PA01H01800
 Laird Technologies EMI GASKT FABRIC/FOAM 5X457.2MM RECT ActiveFabric Over FoamD-Shape0.197" (5.00mm)18.000" (457.20mm)0.020" (0.50mm)Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
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Adhesive
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4228PA51H01800
 Laird Technologies EMI GSKT FAB/FOAM 3.8X457.2MM DSHAPE ActiveFabric Over FoamD-Shape0.150" (3.80mm)18.000" (457.20mm)0.150" (3.80mm)Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
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Adhesive
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4209PA51H01800
 Laird Technologies EMI GASKT FAB/FOAM 3.94X457.2MM RECT ActiveFabric Over FoamRectangle0.154" (3.90mm)18.000" (457.20mm)0.118" (3.00mm)Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
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Adhesive
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4906PA51H01800
 Laird Technologies EMI GSKT FAB/FOAM 4.8X457.2MM DSHAPE ActiveFabric Over FoamD-Shape0.189" (4.80mm)18.000" (457.20mm)0.130" (3.30mm)Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
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Adhesive
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