Part Number Manufacturer / Brand Brife Description Part StatusTypeShapeWidthLengthHeightMaterialPlatingPlating - ThicknessAttachment MethodOperating Temperature
Laird Technologies EMI TWTSTRBFUSFPSA ActiveFingerstock
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0.300" (7.62mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium Copper
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Adhesive121°C
Laird Technologies EMI CSTRSTRNID Active
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Laird Technologies EMI DESSTRSNBCLO Active
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0.183" (4.65mm)12.000" (304.80mm)
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Laird Technologies EMI TWTSTRBFUSFTCLO Active
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Laird Technologies EMI CSTRSTRSNB Active
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Laird Technologies EMI S3STRSNBPSA ActiveFingerstock
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0.350" (8.89mm)15.000" (381.00mm)0.110" (2.79mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRSNB ActiveFingerstock
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0.350" (8.89mm)15.000" (381.00mm)0.110" (2.79mm)Beryllium Copper
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Adhesive121°C
Laird Technologies EMI TWTSTRBF ActiveFingerstock
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0.500" (12.70mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium Copper
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Adhesive121°C
Laird Technologies EMI TWTSTRSNBUSFPSA ActiveFingerstock
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0.230" (5.84mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI TWTSTRNIBUSFTPSA ActiveFingerstock
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0.230" (5.84mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI TWTSTRSNBUSFPSA ActiveFingerstock
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0.160" (4.06mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI TWTSTRNIBUSFTPSA ActiveFingerstock
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0.160" (4.06mm)24.000" (609.60mm)0.030" (0.76mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI GK NICU NRS PU V0 DSH ActiveFabric Over FoamD-Shape0.402" (10.20mm)48.000" (121.92cm)0.181" (4.60mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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Laird Technologies EMI CSTRSTRBF Active
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Laird Technologies EMI CSTRSTRSNBUSFT Active
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Laird Technologies EMI LSSTRSNBUSFTCLO Active
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Laird Technologies EMI TWTSTRZNCCLO ActiveFingerstock
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0.150" (3.81mm)16.000" (406.40mm)0.030" (0.76mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Clip121°C
Laird Technologies EMI GASKET FABRIC/FOAM 3MM SQ ActiveFabric Over FoamRectangle0.118" (3.00mm)49.700" (126.24cm)0.118" (3.00mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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Laird Technologies EMI TWTSTRZNCPSA ActiveFingerstock
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0.340" (8.64mm)24.000" (609.60mm)0.070" (1.78mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI GK NICU NRS PU V0 BELL ActiveFabric Over FoamBell0.299" (7.60mm)36.000" (914.40mm)0.098" (2.50mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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Laird Technologies EMI DSTRSDECE093 6.4X6.4X3.2MM Active
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Laird Technologies EMI STS3STRZNCPSA ActiveFingerstock
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0.350" (8.89mm)15.000" (381.00mm)0.110" (2.79mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRNIEPSA ActiveFingerstock
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0.350" (8.89mm)15.000" (381.00mm)0.110" (2.79mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRNIBPSA ActiveFingerstock
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0.350" (8.89mm)15.000" (381.00mm)0.110" (2.79mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI DSTRSDCUSTMATL 6.35X6.35X3.18MM Active
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Laird Technologies EMI FINGERSTOCK BECU 10.4X406.4MM ActiveFingerstock
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0.414" (10.52mm)16.000" (406.40mm)0.210" (5.33mm)Beryllium Copper
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Clip121°C
Laird Technologies EMI CSTRSTRBF Active
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Laird Technologies EMI CSTRSTRBF ActiveFingerstock
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1.630" (41.40mm)25.000' (7.60m)0.410" (10.41mm)Beryllium Copper
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Hardware, Rivet, Solder121°C
Laird Technologies EMI AMDFBECURL .250X.750IN ActiveGasketDouble D-Shape0.750" (19.10mm)
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0.252" (6.40mm)
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Unplated
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Laird Technologies EMI FINGERSTOCK BECU 15.24X406.4MM ActiveFingerstock
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0.600" (15.24mm)16.000" (406.40mm)0.210" (5.33mm)Beryllium Copper
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Clip121°C
Laird Technologies EMI CSTRSTRSNBUSFT Active
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Laird Technologies EMI PCBSCOILSNB .084X.715X.200X25F Active
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Laird Technologies EMI GK NICU NRS PU V0 CSH ActiveFabric Over FoamC-Fold0.280" (7.10mm)18.000" (457.20mm)0.252" (6.40mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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Laird Technologies EMI APSTRBF ActiveFingerstock
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0.280" (7.11mm)16.000" (406.40mm)0.110" (2.79mm)Beryllium Copper
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Adhesive121°C
Laird Technologies EMI GK NICU NRSG PU V0 REC ActiveFabric Over FoamRectangle0.394" (10.00mm)51.000" (129.54cm)0.079" (2.00mm)
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Adhesive
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Laird Technologies EMI TWTSTRSNBCLO ActiveFingerstock
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0.210" (5.33mm)16.000" (406.40mm)0.140" (3.56mm)Beryllium CopperTin299.21µin (7.60µm)Clip121°C
Laird Technologies EMI CSTRSTRSNSAT Active
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Laird Technologies EMI NOSG COIL BF USF PSA ActiveFingerstock
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0.250" (6.35mm)16.000" (406.40mm)0.080" (2.03mm)Beryllium CopperUnplated
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Adhesive121°C
Laird Technologies EMI CSTRSTRSNB Active
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Laird Technologies EMI GK NICU NRS PU V0 CSH ActiveFabric Over FoamC-Fold0.591" (15.00mm)21.200" (538.48mm)0.673" (17.10mm)Polyurethane Foam, Nickel-Copper Polyester (NI/CU)
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Adhesive
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Laird Technologies EMI FINGERSTOCK BECU 1.6X304.8MM ActiveFingerstock
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0.183" (4.65mm)12.000" (304.80mm)0.055" (1.40mm)Beryllium CopperUnplated
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Clip
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Laird Technologies EMI ECREPUSCFPSACTL 15X50X420MM Active
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Laird Technologies EMI STS3STRZNCPSA ActiveFingerstock
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0.450" (11.43mm)15.000" (381.00mm)0.140" (3.56mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRSNBPSA ActiveFingerstock
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0.450" (11.43mm)15.000" (381.00mm)0.140" (3.56mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRNIEPSA ActiveFingerstock
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0.450" (11.43mm)15.000" (381.00mm)0.140" (3.56mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI S3STRNIBPSA ActiveFingerstock
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0.450" (11.43mm)15.000" (381.00mm)0.140" (3.56mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI TWTSTRSNBCLO ActiveFingerstock
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0.150" (3.81mm)16.000" (406.40mm)0.030" (0.76mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI APSTRSNBPSA ActiveFingerstock
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0.600" (15.24mm)24.000" (609.60mm)0.230" (5.84mm)Beryllium CopperTin299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI APSTRZNCPSA ActiveFingerstock
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0.600" (15.24mm)24.000" (609.60mm)0.230" (5.84mm)Beryllium CopperZinc + Clear Chromate299.21µin (7.60µm)Adhesive121°C
Laird Technologies EMI APSTRNIBPSA ActiveFingerstock
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0.600" (15.24mm)24.000" (609.60mm)0.230" (5.84mm)Beryllium CopperNickel299.21µin (7.60µm)Adhesive121°C