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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 12WLCSP |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 12-UFBGA, WLCSP | 12-WLCSP (2.31x2.03) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 5ms | - | SPI - Quad I/O | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8VSOP |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |
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Winbond Electronics |
IC DRAM 16M PARALLEL 50TSOP II |
Active | Volatile | DRAM | SDRAM | 16Mb (1M x 16) | 200MHz | - | 4.5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
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Winbond Electronics |
IC DRAM 16M PARALLEL 50TSOP II |
Active | Volatile | DRAM | SDRAM | 16Mb (1M x 16) | 200MHz | - | 4.5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
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Winbond Electronics |
IC DRAM 16M PARALLEL 50TSOP II |
Active | Volatile | DRAM | SDRAM | 16Mb (1M x 16) | 166MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8XSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-XSON (4x4) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 5ms | - | SPI - Quad I/O | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 16SOIC |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 8DIP |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 16SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 5ms | - | SPI - Quad I/O | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8SOIC |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8VSOP |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 8DIP |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 16SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 133MHz | 3ms | - | SPI - Quad I/O | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 16SOIC |
Last Time Buy | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | 104MHz | 60µs, 5ms | - | SPI - Quad I/O, QPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC DRAM 64M PARALLEL 66TSOP II |
Active | Volatile | DRAM | SDRAM - DDR | 64Mb (4M x 16) | 200MHz | 15ns | 55ns | Parallel | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
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Winbond Electronics |
IC DRAM 16M PARALLEL 50TSOP II |
Active | Volatile | DRAM | SDRAM | 16Mb (1M x 16) | 166MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 16WLCSP |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 16-UFBGA, WLCSP | 16-WLCSP (2.47x3.12) |
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Winbond Electronics |
IC DRAM 16M PARALLEL 50TSOP II |
Active | Volatile | DRAM | SDRAM | 16Mb (1M x 16) | 166MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
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Winbond Electronics |
IC DRAM 64M PARALLEL 54TSOP |
Active | Volatile | DRAM | SDRAM | 64Mb (4M x 16) | 200MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC DRAM 64M PARALLEL 54TSOP |
Active | Volatile | DRAM | SDRAM | 64Mb (4M x 16) | 166MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Winbond Electronics |
IC DRAM 64M PARALLEL 54TSOP |
Active | Volatile | DRAM | SDRAM | 64Mb (4M x 16) | 200MHz | - | 5ns | Parallel | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 16SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 8VSOP |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 8WSON |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 16SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Winbond Electronics |
IC FLASH 64M SPI 133MHZ 24TFBGA |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 133MHz | 3ms | - | SPI | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC DRAM 64M PARALLEL 66TSOP II |
Active | Volatile | DRAM | SDRAM - DDR | 64Mb (4M x 16) | 250MHz | 15ns | 55ns | Parallel | 2.4 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
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Winbond Electronics |
IC FLASH 64M SPI 104MHZ 8SOIC |
Active | Non-Volatile | FLASH | FLASH - NOR | 64Mb (8M x 8) | 104MHz | 5ms | - | SPI | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |